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Laser systems for semiconductor industry

In the semiconductor production the material processing with lasers is standard. This ranges from marking of wafers and marking and separating of completed components to defect analysis. Besides silicon, metallic materials (lead frames and housings) and plastics, especially epoxy resins of grouting materials are processed.


Our laser systems are specialised to meet the partially extreme demands on highly specialized processes in the semiconductor production.

Waferlase® 200/300/450   Waferlase® ID    
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The fully automated modular system comprises a market-leading handling system for (ultra) thin semiconductor wafers and a choice of...
Waferlase ID systems are designed to meet the most stringent requirements...